BIODEVICES_CHINA is part of BIOSTEC_CHINA, the 20th International Joint Conference on Biomedical Engineering Systems and Technologies. Registration to BIODEVICES_CHINA allows free access to all other BIOSTEC_CHINA conferences.
BIOSTEC will take place in the following dates and venues:
📍 Valletta, Malta
19–21 February
📍 Nanjing, China
14–16 May
Attendees may participate at either venue or attend both.
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Exceptionally, speakers are allowed to present remotely if unable to travel to Malta (hybrid support).
In China, all presentations must be delivered in person; remote presentations are not possible.
Upcoming Submission Deadlines
Position/Regular Paper Submission:
October 22, 2026
Abstracts Track Submission:
December 3, 2026
(See Important Dates for more information)
The purpose of the International Conference on Biomedical Electronics and Devices is to bring together researchers and practitioners from electronics, biomedical engineering, mechanical engineering, physics and related topics, who are interested in developing, studying and using innovative materials, devices and systems inspired by biological systems and/or addressing biomedical requirements. Monitoring and diagnostics devices, sensors and instrumentation systems, biorobotics and prosthetics, micro-nanotechnologies including microfluidics systems and biomaterials are some of the technologies addressed at this conference. The fabrication and evaluation of biodevices, including wearable and implantable devices is also addressed.
Hugo Gamboa, Nova University of Lisbon, PortugalGiovanni Saggio, University of Tor Vergata, Rome, Italy
Liliane Ventura, Dep. Electrical Engineering (Ophthalmic Instrumentation Lab), University of Sao Paulo, BrazilHuacheng He, Oujiang Laboratory, China
Guorong Wu, University of North Carolina at Chapel Hill, United StatesJiang Wu, Wenzhou Medical University, ChinaXun Chen, University of Science and Technology of China, China
Publications:
It is planned to publish a short list of revised and
extended versions of presented papers with
Springer in a CCIS Series book (final approval pending)
Proceedings will be submitted for evaluation for indexing by: